Engineer - Technology & Integration for eNVM Development



Stellenangebotsnummer: 21003015

(Diese Stellenausschreibung ist nur in englischer Sprache verfügbar.)


GLOBALFOUNDRIES is a world-leading contract manufacturer for the global semiconductor industry with facilities in Dresden, Singapore, New York and Vermont (USA). Our products are used in various technical applications, e.g. mobile communications, consumer electronics, automotive and Internet of Things. GLOBALFOUNDRIES employs around 16,000 people worldwide, including 3,200 in Dresden.

Summary of Role

We are looking for a FEoL process integration engineer (m/f/d) to contribute to our development and manufacturing activities in the Integration eMEMORY department in Fab1 Dresden/Germany. You will be a member of a highly-skilled team working on embedded non-volatile memory (eNVM) technologies. The task of the team is to define, co-develop and implement non-volatile device concepts as well as to maintain established non-volatile process flows in leading-edge technologies in agreement with customers’ needs.

Essential Responsibilities include

  • Own and co-optimize competitive integrated process modules to meet electrical, and reliability specifications at optimum yield levels within the frame work of an embedded NVM technology.
  • Clear understanding of eNVM specific process interactions. Familiar with eNVM cell design, electrical test structures, and test conditions.
  • Design experiments dedicated to the continuous development for leading-edge eNVM technologies.
  • Interface with device, yield and reliability teams on cross-functional issues affecting eNVM device related performance, yield, or reliability impacting products.
  • Communicate project status and results internally to GLOBALFOUNDRIES and occasionally to external stakeholders.

Required Qualifications

  • Bachelor/Master Degree and/or PhD in Physics/Electrical/Electronic Engineering or related field.
  • 1-5 years of professional experience in Process Integration and/or Device knowledge of advanced CMOS nodes (55nm, 40nm, 28nm or smaller).
  • Preferably, but not a prerequisite, you have specific knowledge of eNVM devices to actively contribute to technology improvements in agreement with customers’ needs.
  • You have strong capabilities in the design, execution, and analysis of experiments.
  • Capability and deep interest in resolving complex technical problems.
  • We are looking for a team player with strong communication skills who is able to efficiently exchange ideas and share results within and between teams with different technical background.
  • We expect competence in both, written and spoken English as well as solid knowledge in use of standard office software (Excel/PowerPoint). Proficiency in German language is a plus.
  • Willingness in traveling.

We offer

The position is open-ended and should be filled as soon as possible.

Our attractive salary and the social benefits of an international company speak for themselves: 13 monthly salaries, bonus payments, and attractive vacation conditions. We provide you with financial support when you move to Dresden if you live more than 100 km away. For additional free time, you may be able to convert parts of your 13th monthly salary into free time. The continued payment of wages in case of illness is a matter of course. You can expect regular training and interesting development prospects. Further attractive fringe benefits can be found in detail at .

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